Relay with world’s smallest footprint to be unveiled at Semicon West

Pickering Electronics plan to release an exciting new Reed Relay, the Series 120, at Semicon West 2017, at booth 5162.

The Pickering Series 120 is a range of Single Pole (1 Form A) reed relays that will require a board area of only 4mm x 4mm, making it the highest packing density currently available, taking up the smallest board area ever.

Two switch types are available, a general purpose sputtered ruthenium switch rated for up to 20 Watts, 1 Amp and a low level sputtered ruthenium switch rated at 10 Watts, 0.5 Amps.

These are the same reed switches as used in many other long established Pickering Electronics ranges but are orientated vertically within the package, allowing this very high density.

The small size of the package does not allow an internal diode. Back EMF suppression diodes are included in many relay drivers but if they are not, and depending on your drive methods, these may have to be provided externally.

The relays feature an internal mu-metal magnetic screen. Mu-metal has the advantage of a high permeability and low magnetic remanence and eliminates problems that would otherwise occur due to magnetic interaction. Relays of this small size without magnetic screening would be totally unsuitable for applications where dense packing is required.

The image to the right has a total of 528 Series 120 relays on Pickering Interfaces’ ultra-high-density module, illustrating the packing density of these extremely small Reed Relays.

The device has pins on a 2mm square pitch. There are suitable connectors available from some manufacturers, both SMD and Through Hole, that will allow these relays to be stacked in either a row or in a matrix on a 4mm pitch.

To learn more about this industry changing Reed Relay visit Pickering Electronics in booth 5162 at Semicon West 2017 this July.

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