- ABOUT
- REED RELAYS
- BY SERIES NO.
- Single-in-Line (SIL/SIP) Relays Series 100 – 110
- 100 – Low Thermal EMF Relays
- 101 – Direct Drive From CMOS
- 102 – Up to 20W Coaxial RF/High Speed Digital
- 103 – Low Capacitance – Wide Bandwidth
- 104 – HV 1kV Switching, 3kV Stand-Off
- 105 – 20W (Dry) & 50W (Mercury)
- 106 – 0.2” x 0.8” Standard Size up to 20W
- 107 – Mu-metal Standard Size up to 20W
- 108 – 0.15” x 0.8” Mu-Metal Screened Relay
- 109 – 0.15” x 0.6” – Up to 20W + RF
- 110 – 0.15” x 0.4” – Up to 20W
- Single-in-Line (SIL/SIP) Relays Series 111 – 119
- 111 – 0.15” x 0.4” 5W + 1.5GHz RF
- 112 – 0.15” x 0.4” 10W High Density
- 113 – 0.15” x 0.5” 3W (Form C), 10W (Form A)
- 114 – 40W High Power SIP
- 115 – Up to 1 Amp, 20W High Density
- 116 – 0.5A, 10W Very High Density
- 117 – 0.5W, 5W Very High Density
- 118 – High Coil Resistance – Small Size
- 119 – Up to 3KV Stand-off – Mini High Voltage
- Dual-in-Line (DIL/DIP) Relays
- Ultra-High Density 4mm Relays
- High Voltage (HV) Relays
- Classic – Legacy Relays
- Surface Mount (SMD) Relays
- Single-in-Line (SIL/SIP) Relays Series 100 – 110
- BY APPLICATION
- CUSTOM RELAYS
- BY SERIES NO.
- HOW TO BUY
- RESOURCES
- NEWS
- SUPPORT
50 years of designing, manufacturing & distributing quality Reed Relays
T +44 (0) 1255 428 141
Email: sales@pickeringrelay.com
Pickering Electronics Ltd
Stephenson Rd, Clacton, Essex, England, CO15 4NL
This educational book provides an overview of how reed relays work, how they are constructed and how to interpret their specifications and make best use of them in their applications.
Contents include:
- Reed relay basics
- Comparing reed relays with other relay technologies
- Packaging reed relays
- Manufacturing test of reed relays
- Choosing a reed relay
- Placing and driving a reed relay coil
- Loading reed relays
- Understanding specifications
- Relay terminology
This book is intended to be a practical book about reed relays aimed at engineers. It requires little or no theoretical knowledge about the materials they are constructed from, all the issues are dealt with in a practical manner.
With the information supplied in this book we hope users will better understand the efforts that go into designing what in principle is a simple component but which in practice is a complicated product full of engineering compromises and best value judgements.
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