Reed Relays for Semiconductor Testing
Once a semiconductor wafer is fabricated, but before it is ‘sliced and diced’ into the dies that will be packed into components, it is subjected to wafer probe testing. The tests are performed by wafer probing machines, a type of automatic testing equipment (ATE) that is used to verify the functionality of the individual dies, be they relatively simple structures such as diodes and transistors or more complex integrated circuits such as processors, microcontrollers, memory, and analog to digital converters.
The probes are moved around the wafer to connect with pads on the surface of the individual die and to apply test conditions (voltages, currents, or waveforms, for example) that the ATE supplies and to measure voltage levels, current flow, output waveforms, for example that the ATE needs to record.
Semiconductor test methods include DC parametric testing (at different levels of current and voltage) and AC parametric testing (at different frequencies) – both to ensure the device meets the required specifications – and functional testing to ensure that it operates as intended. For power semiconductor devices it is necessary to apply and record high voltages and for high frequency / radio frequency (HF/RF) devices it is necessary to apply and record appropriate waveforms.
Above, an example of a testing configuration.
All of this means the ATE must be capable of applying a variety of test conditions. However, the probe station may have only a few probes (just two is fairly standard), so the ATE needs to be able to switch between multiple test conditions and channel the test results into the appropriate signal conditioning circuitry. And this is where reed relays, as controllable switching devices, prove invaluable – and for five reasons…
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Contents of the application guide:
- Semiconductor Testing
- 5 Reasons Why Reed Relays are Ideal
- Recommended Products
- Why Pickering Electronics for Reed Relays?
Recommended Reed Relays for use in Semiconductor Testing
Ultra High Density Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Fast operate and release times (as low as 80μs or less) make these relays suitable for high-speed test systems. Body dimensions from (W x H x D): 3.9 x 9.5 x 3.9mm. Available forms: 1 Form A contact configuration.
High Density Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Switches feature sputtered ruthenium contacts for long life and high reliability. Body dimensions from (W x H x D): 6.6 x 9.5 x 3.7mm. Available forms: 1 Form A, 1 Form A Coax, 2 Form A, 1 Form B, and 1 Form C contact configurations.
Miniature High-Voltage Reed Relays
These relays have switching voltages up to 1.5kV and standoff voltages up to 5kV. The maximum switch current is 1A (up to 25W) and the maximum carry current is 1.5A. High coil resistance options (up to 6.8kΩ). Thermal EMF devices are between 3 and 10μV. Relays can endure temperatures as high as 150°C if requested. Body dimensions from (W x H x D): 12.5 x 6.6 x 3.7mm. Available forms: 1 Form A, 2 Form A, and 1 Form B contact configurations.
High Voltage Reed Relays
These relays have switching voltages up to 12.5kV and minimum standoff voltages up to 15kV. The maximum switch current is 3A (up to 200W) and the maximum carry current is up to 5A. Option of PCB pins, chassis, PCB mounting, and flying leads. Body dimensions from (W x H x D): 58.4 x 19.0 x 12.6mm. Available forms: 1 Form A, 1 Form B, and 1 Form C contact configurations.
High Coil Resistance Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Featuring high coil resistances (up to 6kΩ), devices are ideal for portable instruments. Body dimensions from (W x H x D): 8.13 x 15.24 x 4.8mm. Available forms: 1 Form A, 2 Form A, 1 Form B, and 1 Form C contact configurations.
Low Thermal EMF Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Devices feature low thermal EMF (around 1μV or less) and low power consumption. Body dimensions from (W x H x D): 20.1 x 9.4 x 7.4mm. Available forms: 1 Form A, 2 Form A, 1 Form B, and 1 Form C contact configurations.
Industry Standard Size Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Featuring superb contact resistance stability and ultra-high insulation resistance. Body dimensions from (W x H x D): 19.1 x 7.6 x 4.8mm. Available forms: 1 Form A, 2 Form A, 1 Form B, 1 Form C, and 2 Form C contact configurations.
Low Capacitance Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Ultra-low capacitance levels of typically 0.1pf, compared to typically 2.5pF for a standard device. Body dimensions from (W x H x D): 19.1 x 8.1 x 4.8mm. Available forms: 1 Form A contact configuration.
Coaxial Reed Relays
These relays have a maximum switch current of 1A (up to 20W), and the maximum carry current is 1.2A. Devices with 50 and 75Ω coils are suitable for up to 5GHz, making them ideal for RF Signal Switching, RF switched tunable filters, and High-Speed Digital Switching. Available in thru-hole and SMT. Body dimensions from (W x H x D): 12.5 x 6.6 x 3.7mm. Available forms: 1 Form A and 1 Form B
