Tiny footprint relays feature very fast operate and release times making them ideal for high speed test systems. Pickering Electronics, the reed relay company which has pioneered miniaturisation and high performance for over 50 years, has announced industry’s smallest reed relay. The Series 124 is part of Pickering’s new ultra-high density 4mm2 TM product line, which takes up

Last year, Pickering Interfaces, the manufacturer of  modular signal switching and simulation products for use in electronic test and verification, launched a new generation of 1 amp PXI matrices that delivers twice the density of competing modules. One of the key components in any module of this type is the switching element – the reed

The reed relay was invented in 1936 by Bell Telephone Laboratories. Since that time, it has gradually evolved from very large, relatively crude parts to the small, ultra-reliable parts we have today. Production methods and quality systems have improved a great deal over that time, and costs have been radically reduced. Pickering Electronics, an established

Pickering Electronics, a long-established Reed Relay manufacturer, will showcase the exciting new Series 120 4mm² Reed Relay range at Electronica China, on booth E.5910. Pickering’s new Series 120 4mm2 TM reed relay range has attracted a lot of interest since being released in July at Semicon West in San Francisco, U.S.A. The relays require a

Pickering Electronics, a UK designer and manufacturer of Reed Relays, has announced they are now a member of the Electronics Representatives Association (ERA), the international trade organization for professional field sales companies in the global electronics industries, manufacturers who go to market through representative firms and global distributors. Since 1968, Pickering Electronics have been manufacturing

Pickering Electronics, a manufacturer of high-quality reed relays, has announced that this year marks 50 years in business. Pickering Electronics was founded in 1968 by the late John Moore. Five decades later its future is looking bright, with sales in 2017 up by 30% on the previous year. “Fifty years of designing, manufacturing and distributing

Pickering Electronics, an innovator and manufacturer of high-quality Reed Relays, plan to showcase the world’s highest density Reed Relay at Semicon Korea 2018, on booth A611. Pickering’s new Series 120 4mm2 TM reed relay range (Figure 1) has attracted a lot of interest since being released in 2017 at Semicon West in San Francisco. The

Pickering Electronics, a local electronics company manufacturing high-tech electronic relays, has announced that it has been in business for an impressive 50 years and is still going strong, with sales in 2017 up by 30% on the previous year. Founded in 1968 by the late John Moore, the future of the business Mr Moore built

Pickering Electronics, a long-established Reed Relay manufacturer, will showcase the world’s highest density Reed Relay at Productronica 2017, on booth A1.452. Pickering’s new Series 120 4mm2 TM reed relay range (Figure 1) has attracted a lot of interest since being released in July at Semicon West in San Francisco. The relays require a board area

Rapid Electronics, a leading UK electronics distributor, has partnered with Pickering Electronics to become their first official distributor in the UK. “I am delighted to welcome Pickering to the Rapid relay portfolio”, said Richard Abbott, Product Manager of Electronic Components at Rapid. “Pickering are a company with a wealth of experience in the design and

Pickering Electronics has unveiled a new reed relay that requires a board area of mere 4 x 4 mm. The company claims that its Series 120 relays occupy the smallest board area while boasting the highest packing density currently available. The new reed relays are available in two switch types: a general-purpose sputtered ruthenium switch

Pickering Electronics plan to release exciting new Reed Relay, the Series 120, at Semicon West 2017, on booth 5162. The Pickering Series 120 is a range of Single Pole (1 Form A) reed relays that will require a board area of only 4mm x 4mm, making it the highest packing density currently available, taking up